Our mobile channel includes smartphones, tablets and phablets.

Our device selection is based on point of sale (POS) data and covers a variety of geographical centres. Teardown reports also include an in-depth cost estimate of the bill of materials (BOM).

Deep insights into design win information

Details on how the product is built

Innovative design features and supply chain relationships

In-depth cost estimate of the bill of materials (BOM) included

Available mobile devices teardown reports

Our Teardown reports use a standard format to help you quickly navigate each device report and find the data that’s important to you. Three types of teardown reports provide increasing analysis and insights:

Projected number of teardowns: 190 reports annually

 

Deep Dive Teardown Reports

Our mobile channel includes smartphones, tablets and phablets. Our device selection is based on point of sale (POS) data and covers a variety of geographical centres.

Our most exhaustive and popular type of teardown report, available across all channels.

A full product teardown that includes:

 

  • ICs identification and costing
  • A PDF report containing pictures of circuit boards with annotated ICs, major subassemblies, antennas
  • Die photos for major ICs and tables for features description and dimensional data
  • Costed bill of materials (BOM) spreadsheet
  • RF block diagram
  • System block diagram

Deep Dive report coverage is not limited to electronics, it also includes a BOM for all non-electronic parts, each of which is also costed, so we can provide a total cost for the product.

 

Survey Plus Teardown Reports

Available only for our Mobile Device Channel, and includes:

 

  • A PDF report containing pictures of circuit boards with annotated ICs, major subassemblies, antennas
  • Die photos for major ICs and tables for features description and dimensional data
  • Costed bill of materials (BOM) spreadsheet
  • RF block diagram

Survey Plus Reports are essentially a major electronics teardown where we catalog and identify ICs for all major functions.

Quick Turn Teardown Reports

Get a quick look before the final report is ready.

Quick Turn reports are meant to help you quickly identify the major IC wins at a system level.

  • Costed bill of materials (BOM) spreadsheet

 

 

 

 

Access the data you need faster than ever

A subscription gives you the data you need - instantly. Using a high-speed search engine, you have access to our latest teardown data. View or download images and reports; compare products and determine the relationships between components and devices. With TechInsights' Teardown subscriptions, you’ll always be on top of our latest teardown data.